- Title:
Quantification and modeling of dough microstructure by the use of image analysis
- Author(s):
- Jekle, M., Becker, T.
- Book / Congress title:
- 2011 AACC International Annual Meeting
- Congress city:
- Palm Springs
- Date of congress:
- 18.10.2011
- Year:
- 2011
- BibTeX