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- Title:
Resilience Articulation Point (RAP): Cross-layer ependability modeling for nanometer system-on-chip resilience
- Document type:
- Magazinartikel
- Author(s):
- Andreas Herkersdorf, Hananeh Aliee, Michael Engel, Michael Glaß, Christina Gimmler-Dumont, Jörg Henkel, Veit Kleeberger, Michael Kochte, Johannes Maximilian Kühn, Daniel Müller-Gritschneder, Sani Nassif, Holm Rauchfuss, Wolfgang Rosenstiel, Ulf Schlichtmann, Muhammad Shafique, Mehdi Baradaran Tahoori, Jürgen Teich, Norbert Wehn, Christian Weis, Hans-Joachim Wunderlich
- Keywords:
- VirTherm 3D
- Dewey Decimal Classification:
- 620 Ingenieurwissenschaften
- Journal title:
- Microelectronics Reliability
- Year:
- 2014
- Journal volume:
- Volume 56
- Year / month:
- 2014-06
- Journal issue:
- Issues 6-7
- Pages contribution:
- pp 1066-1074
- Language:
- en
- Fulltext / DOI:
- doi:http://dx.doi.org/10.1016/j.microrel.2013.12.012
- WWW:
- http://www.sciencedirect.com/science/article/pii/S0026271413004630
- E-ISSN:
- 0026-2714
- TUM Institution:
- Lehrstuhl für Integrierte Systeme
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