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Title:

Virtualized and Fault-Tolerant Inter-Layer-Links for 3D-ICs

Document type:
Zeitschriftenaufsatz
Author(s):
Felix Miller, Thomas Wild, Andreas Herkersdorf
Keywords:
NEEDS
Dewey Decimal Classification:
620 Ingenieurwissenschaften
Journal title:
Microprocessors and Microsystems
Year:
2013
Journal volume:
Volume 37
Year / month:
2013-11
Journal issue:
Issue 8
Pages contribution:
pp 823-835
WWW:
http://dx.doi.org/10.1016/j.micpro.2013.04.013
Publisher:
Elsevier B.V.
E-ISSN:
0141-9331
TUM Institution:
Lehrstuhl für Integrierte Systeme
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