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- Title:
Virtualized and Fault-Tolerant Inter-Layer-Links for 3D-ICs
- Document type:
- Zeitschriftenaufsatz
- Author(s):
- Felix Miller, Thomas Wild, Andreas Herkersdorf
- Keywords:
- NEEDS
- Dewey Decimal Classification:
- 620 Ingenieurwissenschaften
- Journal title:
- Microprocessors and Microsystems
- Year:
- 2013
- Journal volume:
- Volume 37
- Year / month:
- 2013-11
- Journal issue:
- Issue 8
- Pages contribution:
- pp 823-835
- WWW:
- http://dx.doi.org/10.1016/j.micpro.2013.04.013
- Publisher:
- Elsevier B.V.
- E-ISSN:
- 0141-9331
- TUM Institution:
- Lehrstuhl für Integrierte Systeme
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