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- Titel:
Thermal-Aware Placement and Routing for 3D Optical Networks-on-Chips
- Dokumenttyp:
- Konferenzbeitrag
- Autor(en):
- Jiao, Fengxian; Dong, Sheqin; Yu, Bei; Li, Bing; Schlichtmann, Ulf
- Kongress- / Buchtitel:
- IEEE International Symposium on Circuits and Systems (ISCAS)
- Jahr:
- 2018
- Monat:
- may
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