Temperature Modeling and Emulation of an ASIC Temperature Monitor System for Tightly-Coupled Processor Arrays (TCPAs)

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Title:: Temperature Modeling and Emulation of an ASIC Temperature Monitor System for Tightly-Coupled Processor Arrays (TCPAs)
Author(s):: Glocker, Elisabeth; Boppu, Srinivas; Chen, Qingqing; Schlichtmann, Ulf; Teich, Jürgen; Schmitt-Landsiedel, Doris
Journal title:: Advances in Radio Science
Year:: 2013
Month:: nov
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