Alexandra Schewski, Simon Lang, Ulrich Schaber, Armin Klumpp, Felix Rucker, Oscar Gargiulo, Daniela Zahn, Ramon Linke, Johannes Weber, Christoph Kutter, Rui Pereira, Marc Tornow, Wilfried Lerch, Ignaz Eisele
CMOS-compatible wafer-scale MOCVD of superconducting TiN in Through Silicon Vias for 3D integration of qubits
APS March Meeting Abstracts
2024

MERCK PATENT GMBH, DE
ELECTRONIC ELEMENT COMPRISING A PLURALITY OF CELLS ARRANGED IN A THREE DIMENSIONAL ARRAY OF CELLS AND METHOD FOR PRODUCING SUCH AN ELECTRONIC DEVICE
2024

MERCK PATENT GMBH, DE
Two bit memory device and method for operating the two-bit memory device and electronic component
2024

MERCK PATENT GMBH, DE
Method for producing an electronic component which includes a self-assembled monolayer
2024

MERCK PATENT GMBH, DE
Process for the production of an electronic component comprising a self-assembled monolayer
2024

MERCK PATENT GMBH, DE
ELECTRONIC SWITCHING DEVICE
2024

MERCK PATENT GMBH, DE
TWO BIT MEMORY DEVICE AND METHOD FOR OPERATING THE TWO-BIT MEMORY DEVICE AND ELECTRONIC COMPONENT
2024

Chryssikos, Domenikos;Fereiro, Jerry A.;Rojas, Jonathan;Bera, Sudipta;Tüzün, Defne;Kounoupioti, Evanthia;Pereira, Rui N.;Pfeiffer, Christian;Khoshouei, Ali;Dietz, Hendrik;Sheves, Mordechai;Cahen, David;Tornow, Marc
Mono‐Exponential Current Attenuation with Distance Across 16 nm Thick Bacteriorhodopsin Multilayers
Advanced Functional Materials
2024
34
48

Schoof, Benedikt;Singer, Moritz;Lang, Simon;Gupta, Harsh;Zahn, Daniela;Weber, Johannes;Tornow, Marc
Development of TiN/AlN-Based Superconducting Qubit Components
1228-1232
2024 IEEE International Conference on Quantum Computing and Engineering (QCE)
IEEE
2024

Singer, Moritz;Schoof, Benedikt;Gupta, Harsh;Zahn, Daniela;Weber, Johannes;Tornow, Marc
Tantalum Thin Films Sputtered on Silicon and on Different Seed Layers: Material Characterization and Coplanar Waveguide Resonator Performance
1197-1202
2024 IEEE International Conference on Quantum Computing and Engineering (QCE)
IEEE
2024