User: Guest  Login
Sort by:
and:
More ...

Okeil, H.; Erlbacher, T.; Wachutka, G.
Very High Temperature Hall Sensors in a Wafer‐Scale 4H‐SiC Technology
Advanced Materials Technologies
2024
2400046-2400060

More ...

Okeil, H.; Wachutka, G.
4H-SiC Lateral Magnetotransistor with Sub-Microtesla In-Plane Magnetic Field Detectivity
IEEE Electron Device Letters
2024
1-1

More ...

Okeil, H.; Wachutka, G.
4H–SiC Vertical Magnetotransistor with Microtesla Detectivity up to 500 °C
Applied Physics Letters
2024
124
124/19
192101

More ...

Okeil, H.; Erlbacher, T.; Wachutka, G.
Very High In-Plane Magnetic Field Sensitivity in Ion-Implanted 4H-SiC PIN Diodes
2024
2300531-2300546/15

More ...

Leikam, B.; Pandey, S.; Hayden, O.; Schrag, G.
Design Studies and Optimization of Acoustic Pressure in Acoustofluidic Cell Manipulation Platforms
1-5
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
IEEE
2024

More ...

Schiller, F.; Bretthauer, C.; Bogner, A.; Bosetti, G.; Krenzer, M.; Gierl, K.; Haupt, C.; Heiss, H.
OT1.173 - High-Fidelity Modeling of Harmonic Distortions in Piezoelectric MEMS Microphones with a Corrugated Membrane
33-34
Lectures
EUROSENSORS XXXVI
AMA Service GmbH, Von-Münchhausen-Str. 49, 31515 Wunstorf
2024

More ...

Xu, J.; Schrag, G.; Shao, Z.
Machine Learning Strategies for Freeform PMUTs Design
4
IEEE International Ultrasonics Symposium (IUS)
2024

More ...

Friebe, T.; Schrag, G.; Bosetti, G.; Bretthauer, C.
C3.2 - Piezoelektrische MEMS-Mikrofone mit Regelung durch Kraftrückkopplung
236-240
Vorträge
22. GMA/ITG-Fachtagung Sensoren und Messsysteme 2024
AMA Service GmbH, Von-Münchhausen-Str. 49, 31515 Wunstorf
2024

More ...

Bicer, E. A.; Schirmer P.; Schreivogel P.; Schrag G.
Mesago PCIM GmbH
Neural Network Assisted Numerical Simulation Benchmarking for Electric Vehicle Thermal Management System
VDE VERLAG GMBH
2024
9

More ...

Philippin, N.; Kuehne, I.; Schrag, G.
Conformable Electronics with Conductive Silver Structures by Electrohydrodynamic Printing
IEEE Journal on Flexible Electronics
2024
VOL. 3, NO. 7
Jul
348-355