Acoustic High-Frequency Effects Inside the Package of Capacitive Silicon Microphones and Their Impact on the Device Performance

Schrag, G.: Künzig, T.; Glacer, C.; Dehe, A.; Wachutka, G.

Document type:: Konferenzbeitrag
Contribution type:: Textbeitrag / Aufsatz
Author(s):: Schrag, G.: Künzig, T.; Glacer, C.; Dehe, A.; Wachutka, G.
Title:: Acoustic High-Frequency Effects Inside the Package of Capacitive Silicon Microphones and Their Impact on the Device Performance
Pages contribution:: 95170M1-95170M6
Book / Congress title:: Proceedings of SPIE 9517, Smart Sensors, Actuators, and MEMS VII and Cyber Physical Systems
Date of congress:: May, 4-6
Year:: 2015
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