Effizienter fluidischer Transport mittels mikromechanischer Aktoren: Numerische Herausforderungen beim Entwurf / Efficient Transport of Fluids using Micromechanical Actuators: Numerical Challenges within the Design Process
Proceedings of the MikroSystemTechnik Kongress
München, Deutschland
Berlin Offenbach
2017
Entwicklung eines bionisch inspirierten, mikromechanischen Biegewandlers für effizienten fluidischen Massentransport
Proceedings of the MikroSystemTechnik Kongress
2017
Virtuelles Prototyping - Entwurf von integrierten, multifunktionalen Mikrosystemen
Journal of TECHNIK IN BAYERN (TECHNIK IN BAYERN) (05/2017)
2017
05
pp. 12-13
Towards High Fidelity Silicon Microphones: Evaluating the Potential of Industrial Microsystems Applying Tailored System-level Models
6
Proceedings of 18th International Concerence on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
Eurosime 2017
2017
Free-Carrier Absorption Experiments for the Investigation of the Physical Device Properties in IGBTs with Hydrogen-Related Donors
Proceedings of ISPSD 2017
Sapporo, Japan
2017
Modeling of an out-of-plane capacitive MEMS transducer with dynamically coupled electrodes
Proceedings of DTIP 2017, the Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)
Bordeaux, France
2017
Efficient Fluid Transport by a Bionically Inspired Micro-Flapper: Fluidic Investigatins Using Fully Coupled Finite Element Simulation
Proceedings of SPIE Microtechnologies
Barcelona, Spain
2017
A novel silicon "star-comb" microphone concept for enhanced signal-to-ratio: modeling, design and first prototype
pp. 69-70
Proceedings of 19th International Conference on Solid-State Sensors, Actuators and Microsystems 2017
Kaohsiung, Taiwan (Transducers)
2017
Thermoelectric converters with optimum graded materials and current distribution in one dimension and three dimensions
pp. 19
Physica Status Solidi B
Physica Status Solidi B
2017
Transient analysis of latent damage formation in SMD capacitors by Transmission Line Pulsing (TLP)
pp. 97-101
28th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis
Microelectronics Reliability, Vol. 76-77, 2017
2017