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Title:

Wafer edge protection kit for MEMS and TSV Si-Etching

Document type:
Konferenzbeitrag
Author(s):
Wieland, R.; Nguyen, K.; Seidelmann, U.; Scholz, M.; Schrag, G.
Pages contribution:
951724-1 bis 951724-8
Book / Congress title:
Proceedings of SPIE 9517, Smart Sensors, Actuators, and MEMS VII and Cyber Physical Systems
Congress (additional information):
May 4-6, 2015, Barcelona, Spain
Year:
2015
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