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Title:

High-Fidelity 3D FEM Simulation Model for Stress Reduction in MEMS Microphones

Document type:
Konferenzbeitrag
Contribution type:
Vortrag / Präsentation
Author(s):
Zöpfl, T.; Wittman, F.; Schrag, G.; Wachutka, G.,
Pages contribution:
pp. 68-71
Book / Congress title:
EUROSENSORS XXII
Congress (additional information):
07.09.208 - 10.09.2008, Dresden
Year:
2008
Language:
de
Format:
Text
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