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- Title:
Analysis of the Latch-up Process and Current Filamentation in High-Voltage Trench-IGBT Cell Arrays
- Document type:
- Konferenzbeitrag
- Author(s):
- Töchterle, C.; Pfirsch, F.; Sandow, C.; Wachutka, G.
- Pages contribution:
- pp 296-299
- Editor:
- IEEE
- Book / Congress title:
- Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices
- Congress (additional information):
- SISPAD 2013, September 3-5, Glasgow, Scotland, UK
- Year:
- 2013
- Language:
- en
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