- Title:
The Type to Take Out a Loan? A Study of Developer Personality and Technical Debt
- Document type:
- Konferenzbeitrag
- Author(s):
- Graf-Vlachy, Lorenz; Wagner, Stefan
- Book / Congress title:
- 2023 ACM/IEEE International Conference on Technical Debt (TechDebt)
- Year:
- 2023
- Pages:
- 27-36
- Fulltext / DOI:
- doi:10.1109/TechDebt59074.2023.00010
- BibTeX