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Title:

Patterning Platinum by Selective Wet Etching of Sacrificial Pt-Al Alloy

Document type:
Konferenzbeitrag
Contribution type:
Vortrag / Präsentation
Author(s):
S. Meier, H. Rinck, B. Lange, E. Muellner, R. Brederlow, M. Enzelberger-Heim, S. Summerfelt, F. Kreupl, B. Wolf
Abstract:
Regardless of its functionality, there is no IC-compatible process to pattern platinum. This can be attributed to the inertness of the noble metal. Pt survives extreme condi-tions, and is used in electrochemical, temperature, and gas sensors. In this paper, we introduce a process enabling Pt structures of 1μm thickness and submicron feature size on 200mm wafers. It is the industry’s first with focus on high process control while eliminating contamination i...     »
Editor:
IEEE
Book / Congress title:
Electron Devices Technology and Manufacturing Conference (EDTM)
Organization:
IEEE
Date of publication:
16.06.2020
Year:
2020
Covered by:
Scopus
Reviewed:
ja
Language:
en
WWW:
https://ieeexplore.ieee.org/document/9117886
TUM Institution:
Hybride Elektronische Systeme
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