FIRED CERAMIC MOULDING AND METHOD FOR MANUFACTURING A FIRED CERAMIC MOULDING USING ELECTROMAGNETIC RADIATION HAVING A MAXIMUM FREQUENCY OF 300 GHZ
2023

Lymperis Perakis, Julian Balling, Frank Binder, Gerhard Heyer, Franz Kreupl
Classifying figures and illustrations in electronics datasheets: A comparative evaluation of recent computer vision models on a custom collection of 4000 technical documents
INFORMATIK 2023, 53rd annual conference of the German Informatics Society (GI) in Berlin
53rd annual conference of the German Informatics Society (GI) in Berlin
2023

Khan, Zeeshan Ahmad, and Franz Kreupl
Innovative Methods for State of the Charge Estimation for EV Battery Management Systems
Electric Vehicle Integration in a Smart Microgrid Environment
CRC
CRC
2021

Christian Pfeffer, Sabine Zips, Ernst Muellner, Markus Hefele, Franz Kreupl, Bernhard Wolf, Bernhard Wolfrum, Yue Liang, Ralf Brederlow
A Cost-Effective, Impediometric Na+-Sensor in Fluids
IEEE Sensors Letters
2021

Muhammad Mudussir Ayub; Franz Kreupl
5G brings innovation challenges for the spectra of computing and connectivity technology. Cellular modems, in particular, have to support various services and applications requiring low to high data rates. Therefore, the co-optimization of power and performance for architecture along circuit design is inevitable. In order to meet this challenge, this work presents a modular and distributed setup. It first separates functionality from architecture, and second, the way a power database is attached and integrated makes it practical. A simple use-case presented for the network processor demonstrates the effectiveness of the setup/methodology.
IEEE 39th International Performance Computing and Communications Conference (IPCCC)
2021

Muhammad Mudussir Ayub; Franz Kreupl
A Modular and Distributed Setup for Power and Performance Analysis of Multi-Processor-System-on-Chip at Electronic System Level
IEEE International Performance Computing and Communications Conference
2020

Lena Zeitlhoefler; Friedrich zur Nieden; Kai Esmark; Gemot Langguth; Martin Sauter; Franz Kreupl
Simulation of the Transient Potential Distribution On-Chip During a Fast ESD Event Based on a Parametric Measurement Analysis
2020 International Symposium on Electromagnetic Compatibility-EMC EUROPE
2020

S. Meier, H. Rinck, B. Lange, E. Muellner, R. Brederlow, M. Enzelberger-Heim, S. Summerfelt, F. Kreupl, B. Wolf
Patterning Platinum by Selective Wet Etching of Sacrificial Pt-Al Alloy
Electron Devices Technology and Manufacturing Conference (EDTM)
2020

Umidjon Nurmetov, Tobias Fritz, Ernst Müllner, Christopher M. Dougherty, Michael Szelong,Franz Kreupl, and Ralf Brederlow
A CMOS Temperature Stabilized 2-D Mechanical Stress Sensor With 11-bit Resolution
IEEE JOURNAL OF SOLID-STATE CIRCUITS, VOL. 55, NO. 4, APRIL 202
2020

Muhammad Mudussir Ayub ; Habibullah Ahmadzay ; Josef Eckmüller ; Franz Kreupl
Electronic System Level Power and Performance Analysis for Multi-Processor-System-on-Chip
International Conference on Reconfigurable Computing and FPGAs (ReConFig)
2020