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Title:

Operator Inference for Rigid-Flex Printed Circuit Boards Subject to Large Deformations

Document type:
Konferenzbeitrag
Author(s):
den Boef, Pascal; Manvelyan, Diana; Schilders, Wil; Maubach, Joseph; van de Wouw, Nathan
Pages contribution:
1-3
Book / Congress title:
2024 IEEE 33rd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
Publisher:
IEEE
Date of publication:
06.10.2024
Year:
2024
Fulltext / DOI:
doi:10.1109/epeps61853.2024.10754092
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