Operator Inference for Rigid-Flex Printed Circuit Boards Subject to Large Deformations

Titel:: Operator Inference for Rigid-Flex Printed Circuit Boards Subject to Large Deformations
Dokumenttyp:: Konferenzbeitrag
Autor(en):: den Boef, Pascal; Manvelyan, Diana; Schilders, Wil; Maubach, Joseph; van de Wouw, Nathan
Seitenangaben Beitrag:: 1-3
Kongress- / Buchtitel:: 2024 IEEE 33rd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
Verlag / Institution:: IEEE
Publikationsdatum:: 06.10.2024
Jahr:: 2024
Volltext / DOI:: doi:10.1109/epeps61853.2024.10754092
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