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Titel:

Overview of Carbon Nanotube Processing Methods

Dokumenttyp:
Buchbeitrag
Autor(en):
Franz Kreupl
Abstract:
On February 16, in year 2000, the first patent application was filed that proposed to use carbon nanotubes (CNTs) instead of metals as vertical interconnects in advanced microelectronic interconnects on semiconductor chips [1]. This patent, which has been cited in over 150 following patent applications as prior art, emphasizes that CNTs would be especially useful in vertical interconnects (vias). The quasi-ballistic current transport in CNTs would allow very efficient low resistance interconnect...     »
Seitenangaben Beitrag:
81-100
Herausgeber:
Springer
Buchtitel:
Carbon Nanotubes for Interconnects: Process, Design and Applications
Verlag / Institution:
Springer
Publikationsdatum:
10.07.2016
Jahr:
2016
Seiten/Umfang:
20
Nachgewiesen in:
Web of Science
DOI:
doi:10.1007/978-3-319-29746-0_3
WWW:
http://link.springer.com/chapter/10.1007%2F978-3-319-29746-0_3
TUM Einrichtung:
Hybride Elektronische Systeme
Format:
Text
 BibTeX