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- Title:
Reliability and ESD improvement of metal-semiconductor contacts by using a carbon interface laye
- Document type:
- Poster
- Author(s):
- Max Stelzer, Franz Kreupl
- Congress title:
- Infineon Innovation Week
- Chair:
- Hybride Elektronische Systeme
- TUM Institution:
- Hybride Elektronische Systeme
- Date:
- 12.11.2015
- Year:
- 2015
- Language:
- en
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