- Document type:
- Patent
- Patent application number:
- US 8912654 B2
- Inventor:
- KREUPL FRANZ, HEDLER HARRY
- Title:
- Semiconductor chip with integrated via
- Patent office:
- US
- Publication date patent:
- 16.12.2014
- Year:
- 2014
- Pages:
- 14
- Language:
- en
- Covered by:
- Scopus
- TUM Institution:
- Hybride Elektronische Systeme
- Format:
- Text
BibTeX