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Title:

Integrated circuit including doped semiconductor line having conductive cladding

Document type:
Patent
Patent number:
US 8084759
Inventor:
Kreupl; Franz ,Klostermann; Ulrich, Schwerin; Ulrike Gruning-von
Assignee:
Kreupl; Franz ,Klostermann; Ulrich, Schwerin; Ulrike Gruning-von
Patent office:
US
Publication date patent:
27.12.2011
Year:
2011
Language:
en
TUM Institution:
Hybride Elektronische Systeme
Format:
Text
 BibTeX