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- Title:
2D Silicon encapsulation for electronic device fabrication
- Document type:
- Konferenzbeitrag
- Contribution type:
- Textbeitrag / Aufsatz
- Author(s):
- Mock, J.; Pljevljakovic, T.; Kloberg, M.; Lyuleeva, A.; Rieger, B.; Becherer, M.
- Book / Congress title:
- Graphene week
- Congress (additional information):
- Helsinki, Finland, 23-27 Sep 2019-09
- Year:
- 2019
- Quarter:
- 3. Quartal
- Year / month:
- 2019-09
- Month:
- Sep
- Language:
- en
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