Congress Keynote: Assembly Simulation for Re-Design of Plug and Play Modular Buildings.

Titel:: Congress Keynote: Assembly Simulation for Re-Design of Plug and Play Modular Buildings.
Dokumenttyp:: Konferenzbeitrag
Autor(en):: Bock, Th.; Unser, R.
Herausgeber:: International Institute for Construction Technology Information. Tokyo, Japan
Kongress- / Buchtitel:: I2CTI Board Meeting 2007, Tokyo, Japan, 29.-30.11.2007
Jahr:: 2007
Sprache:: en
Format:: Text
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