Monolithic 3D Integration using BEOL FeFET: Reliability, Thermal Effects, and DNN Accuracy

Titel:: Monolithic 3D Integration using BEOL FeFET: Reliability, Thermal Effects, and DNN Accuracy
Dokumenttyp:: Konferenzbeitrag
Autor(en):: Kumar, Shubham; Singh Chauhan, Yogesh; Amrouch, Hussam
Kongress- / Buchtitel:: IEEE Electron Devices Technology & Manufacturing Conference (EDTM'24)
Jahr:: 2024
Monat:: March
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