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- Titel:
Monolithic 3D Integration using BEOL FeFET: Reliability, Thermal Effects, and DNN Accuracy
- Dokumenttyp:
- Konferenzbeitrag
- Autor(en):
- Kumar, Shubham; Singh Chauhan, Yogesh; Amrouch, Hussam
- Kongress- / Buchtitel:
- IEEE Electron Devices Technology & Manufacturing Conference (EDTM'24)
- Jahr:
- 2024
- Monat:
- March
BibTeX
Vorkommen:
- mediaTUM GesamtbestandEinrichtungenSchools TUM School of Computation, Information and TechnologyDepartmentsComputer EngineeringAI Processor Design (Prof. Amrouch)
- mediaTUM GesamtbestandEinrichtungenForschungszentrenMunich Institute of Robotics and Machine Intelligence (MIRMI) - The AI Mission Institute (AIM)