Monolithic 3D Integration using BEOL FeFET: Reliability, Thermal Effects, and DNN Accuracy

Title:: Monolithic 3D Integration using BEOL FeFET: Reliability, Thermal Effects, and DNN Accuracy
Document type:: Konferenzbeitrag
Author(s):: Shahin, Sufia; Kumar, Shubham; Chatterjee, Swetaki; Amrouch, Hussam; Singh Chauhan, Yogesh
Book / Congress title:: IEEE Electron Devices Technology & Manufacturing Conference (EDTM'24)
Year:: 2024
Month:: March
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