- Titel:
Long-Term Aging Impacts on Spatial On-Chip Power Density and Temperature
- Dokumenttyp:
- Konferenzbeitrag
- Autor(en):
- Sachdeva, Sachin; Zhang, Jinwei; Amrouch, Hussam; Tan, Sheldon X.-D.
- Kongress- / Buchtitel:
- 2023 19th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD)
- Jahr:
- 2023
- Seiten:
- 1-4
- Volltext / DOI:
- doi:10.1109/SMACD58065.2023.10192234
- BibTeX