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- Title:
RAP Model—Enabling Cross-Layer Analysis and Optimization for System-on-Chip Resilience
- Document type:
- Buchbeitrag
- Author(s):
- Andreas Herkersdorf, Michael Engel, Michael Glaß, Jörg Henkel, Veit B. Kleeberger, Johannes M. Kühn, Peter Marwedel, Daniel Mueller-Gritschneder, Sani R. Nassif, Semeen Rehman, Wolfgang Rosenstiel, Ulf Schlichtmann, Muhammad Shafique, Jürgen Teich, Norbert Wehn, Christian Weis
- Pages contribution:
- pp 1-27
- Dewey Decimal Classification:
- 620 Ingenieurwissenschaften
- Book title:
- Dependable Embedded Systems
- Volume:
- Part of the Embedded Systems book series (EMSY)
- Publisher:
- Springer
- Year:
- 2021
- Year / month:
- 2021-01
- Print-ISBN:
- 978-3-030-52016-8
- E-ISBN:
- 978-3-030-52017-5
- Language:
- en
- DOI:
- doi:https://doi.org/10.1007/978-3-030-52017-5_1
- WWW:
- https://link.springer.com/chapter/10.1007/978-3-030-52017-5_1
- TUM Institution:
- Lehrstuhl für Integrierte Systeme
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