Multilayer Multichip Modules for Microwave and Millimeterwave Integration

We present a planar integration technology of bare dices embedded in substrates (ceramic,silicon). A thin film multilayer with dielectric polymer layers and sputtered / electroplated wiring is realized in a planar fashion on top of the embedded system. The metalization is based on a Ti:W / Cu tie layer, which is subsequently electroplated with Cu. Polyimid Pyralin¿ (2722 (Du Pont) and Cyclotene¿ (4026-46 (Dow Chemical) are used as interlevel dielectric. The paper addresses high frequency performance, electromagnetic full-wave modeling and equivalent circuit model extraction of the described technologry.     «

We present a planar integration technology of bare dices embedded in substrates (ceramic,silicon). A thin film multilayer with dielectric polymer layers and sputtered / electroplated wiring is realized in a planar fashion on top of the embedded system. The metalization is based on a Ti:W / Cu tie layer, which is subsequently electroplated with Cu. Polyimid Pyralin¿ (2722 (Du Pont) and Cyclotene¿ (4026-46 (Dow Chemical) are used as interlevel dielectric. The paper addresses high frequency perfo...     »