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Title:

Technical Debt Contagiousness Metrics for Measurement and Prioritization in Mechatronics

Document type:
Konferenzbeitrag
Author(s):
Bi, Fandi; Vogel-Heuser, Birgit; Du, Fengmin; Cho, Eunnuri; Hanich, Nils
Abstract:
Underlying and undiscovered technical debt (TD) that burdens the system and makes future changes more costly or impossible poses tremendous risks to mechatronic systems. Multi-disciplinary collaboration and cooperation lead to interdisciplinary interfaces and new life cycle phases that are the root of greater ripple effects to the TD distribution in the system. In terms of the quantification of TD contagiousness in interdisciplinary engineering, only a few metrics, methods, or tools prove to be...     »
Book / Congress title:
Techdebt 2023 - ACM/IEEE International Conference on Technical Debt 2023
Publisher address:
Melbourne, Australia
Year:
2023
Month:
May
Pages:
10
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