User: Guest  Login
Title:

Pretreatment and Structuring of Spatial Circuit Carriers Based on Alumina for High Temperatures and High Frequencies

Document type:
Konferenzbeitrag
Author(s):
Braeuer, Philipp; Stoll, Thomas; Muckelbauer, Martin; Hensel, Alexander; Franke, Joerg
Book / Congress title:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
Publisher:
IEEE
Date of publication:
01.05.2022
Year:
2022
Fulltext / DOI:
doi:10.1109/ectc51906.2022.00162
 BibTeX