Localization and Detection of Bond Wire Faults in Multichip IGBT Power Modules

Title:: Localization and Detection of Bond Wire Faults in Multichip IGBT Power Modules
Document type:: Zeitschriftenaufsatz
Author(s):: Chen, Cuili; Pickert, Volker; Al-Greer, Maher; Jia, Chunjiang; Ng, Chong
Journal title:: IEEE Transactions on Power Electronics
Year:: 2020
Journal volume:: 35
Journal issue:: 8
Pages contribution:: 7804-7815
Fulltext / DOI:: doi:10.1109/tpel.2020.2965019
Publisher:: Institute of Electrical and Electronics Engineers (IEEE)
E-ISSN:: 0885-89931941-0107
Date of publication:: 01.08.2020
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