Within the development of automotive power electronics often spatial requirements lead to asymmetric design of Printed-Circuit-Boards (PCBs). These asymmetries can lead to thermal coupling and in the following to asymmetric thermal loading limiting the reliability of the semiconductor components. This article aims to examine the influence of these asymmetries on the lifetime of a power converter qualitatively and quantitatively through a mission-profile-based electrical and thermal simulation and damage calculation.
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