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Titel:

Technical Debt Contagiousness Metrics for Measurement and Prioritization in Mechatronics

Dokumenttyp:
Konferenzbeitrag
Autor(en):
Bi, Fandi; Vogel-Heuser, Birgit; Du, Fengmin; Cho, Eunnuri; Hanich, Nils
Abstract:
Underlying and undiscovered technical debt (TD) that burdens the system and makes future changes more costly or impossible poses tremendous risks to mechatronic systems. Multi-disciplinary collaboration and cooperation lead to interdisciplinary interfaces and new life cycle phases that are the root of greater ripple effects to the TD distribution in the system. In terms of the quantification of TD contagiousness in interdisciplinary engineering, only a few metrics, methods, or tools prove to be...     »
Kongress- / Buchtitel:
Techdebt 2023 - ACM/IEEE International Conference on Technical Debt 2023
Verlagsort:
Melbourne, Australia
Jahr:
2023
Monat:
May
Seiten:
10
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