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- Title:
Additive Metallization of Alumina with Copper-Titanium Powder Blends for Power Electronic Applications
- Document type:
- Konferenzbeitrag
- Author(s):
- Hecht, Christoph; Schadow, Eric; Sprenger, Mario; Häußler, Felix; Stoll, Thomas; Franke, Jörg
- Book / Congress title:
- 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)
- Publisher:
- IEEE
- Date of publication:
- 11.09.2023
- Year:
- 2023
- Fulltext / DOI:
- doi:10.23919/empc55870.2023.10418396
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