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Title:

Additive Metallization of Alumina with Copper-Titanium Powder Blends for Power Electronic Applications

Document type:
Konferenzbeitrag
Author(s):
Hecht, Christoph; Schadow, Eric; Sprenger, Mario; Häußler, Felix; Stoll, Thomas; Franke, Jörg
Book / Congress title:
2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)
Publisher:
IEEE
Date of publication:
11.09.2023
Year:
2023
Fulltext / DOI:
doi:10.23919/empc55870.2023.10418396
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