Pretreatment and Structuring of Spatial Circuit Carriers Based on Alumina for High Temperatures and High Frequencies

Titel:: Pretreatment and Structuring of Spatial Circuit Carriers Based on Alumina for High Temperatures and High Frequencies
Dokumenttyp:: Konferenzbeitrag
Autor(en):: Braeuer, Philipp; Stoll, Thomas; Muckelbauer, Martin; Hensel, Alexander; Franke, Joerg
Kongress- / Buchtitel:: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
Verlag / Institution:: IEEE
Publikationsdatum:: 01.05.2022
Jahr:: 2022
Volltext / DOI:: doi:10.1109/ectc51906.2022.00162
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