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- Titel:
Generation of 3-dimensional power modules for high temperature applications by thermal copper coating processes
- Dokumenttyp:
- Konferenzbeitrag
- Autor(en):
- Hensel, Alexander; Schwarzer, Christian; Merz, Corinna; Stoll, Thomas; Kaloudis, Michael; Franke, Joerg
- Kongress- / Buchtitel:
- 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC)
- Verlag / Institution:
- IEEE
- Publikationsdatum:
- 01.12.2019
- Jahr:
- 2019
- Volltext / DOI:
- doi:10.1109/eptc47984.2019.9026619
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