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- Title:
Thermal simulation of cable accessories: Comparison of different methods
- Document type:
- Konferenzbeitrag
- Contribution type:
- Textbeitrag / Aufsatz
- Author(s):
- Höfer, L.; Koch, M.; Heckel, M.
- Pages contribution:
- 483-489
- Book / Congress title:
- VDE High Voltage Technology 2020; ETG-Symposium
- Date of congress:
- 09.-11. November
- Publisher:
- VDE
- Publisher address:
- Berlin
- Year:
- 2020
- Print-ISBN:
- 978-3-8007-5353-6
- Reviewed:
- ja
- Language:
- en
- WWW:
- https://ieeexplore.ieee.org/document/9275512
- TUM Institution:
- SoED, HSA
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