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Title:

Cantilever Fabrication by a Printing and Bonding Process

Document type:
Zeitschriftenaufsatz
Author(s):
Rivadeneyra, A.; Fernández-Salmerón, J.; Audo-Acemel, M.; Palma, A.J.; Capitan-Vallvey, L.F.; López-Villanueva, J.A.
Abstract:
Cantilevers are a widely used structure in electronics, covering many applications from switches to different kinds of sensors. The majority of them have been manufactured with complimentary metal-oxide-semiconductor (CMOS) technologies, but the increasing demand on printed electronics also motivates its development with printing techniques. Here, we present a cantilever beam fabricated by printing techniques with a novel manufacturing process that simplifies the fabrication procedure in terms o...     »
Keywords:
Printed electronics cantilever beam plastic foil sacrificial layer sacrificial substrate
Journal title:
Journal of Microelectromechanical Systems (Volume:24 , Issue: 4 ) 2015-08
Year:
2015
Year / month:
2015-08
Quarter:
3. Quartal
Month:
Aug
Pages contribution:
880-886
Language:
en
Fulltext / DOI:
doi:10.1109/JMEMS.2014.2356611
WWW:
http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6909008&queryText=Cantilever+Fabrication+by+a+Printing+and+Bonding+Process&newsearch=true
Publisher:
IEEE Explore Digital Library
Print-ISSN:
1057-7157
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