Vertical-cavity surface-emitting laser flip-chip bonding to silicon photonics chip
Document type:
Konferenzbeitrag
Author(s):
Y. Wang , S. S. Djordjecvic, J. Yao, J. E. Cunningham, X. Zheng, A. V. Krishnamoorthy, M. Muller, M. C. Amann, R. Bojko, N. A. F. Jaeger and L. Chrostowski