Vertical-cavity surface-emitting laser flip-chip bonding to silicon photonics chip

Titel:: Vertical-cavity surface-emitting laser flip-chip bonding to silicon photonics chip
Dokumenttyp:: Konferenzbeitrag
Autor(en):: Y. Wang , S. S. Djordjecvic, J. Yao, J. E. Cunningham, X. Zheng, A. V. Krishnamoorthy, M. Muller, M. C. Amann, R. Bojko, N. A. F. Jaeger and L. Chrostowski
Kongress- / Buchtitel:: IEEE Optical Interconnects Conference (OI)
Jahr:: 2015
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