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- Title:
Thermoplastic Encapsulations of a Sensor Platform by High-Temperature Injection Molding up to 360°C
- Document type:
- Zeitschriftenaufsatz
- Author(s):
- Werner, Valerie; Krumpholz, Roman; Rehekampff, Christoph; Scherzer, Tim; Eblenkamp, Markus
- Journal title:
- Polymer Engineering & Science
- Year:
- 2019
- Pages contribution:
- 1315-1331
- Covered by:
- Scopus
- Fulltext / DOI:
- doi:10.1002/pen.25114
- WWW:
- https://www.scopus.com/record/display.uri?eid=2-s2.0-85065203108&origin=resultslist&sort=plf-f&src=s&st1=Thermoplastic+Encapsulations+of+a+Sensor+Platform+by+High+Temperature+Injection+Molding+up&sid=cdb3af51c8306f1768cbea2daa7f7381&sot=b&sdt=b&sl=105&s=TITLE-ABS-KEY(Thermoplastic+Encapsulations+of+a+Sensor+Platform+by+High+Temperature+Injection+Molding+up)&relpos=0&citeCnt=0
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