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Title:

Signal Sweeping Technique to Decouple the Influence of Junction Temperature and Bondwire Lift-off in Condition Monitoring for Multichip IGBT Modules

Document type:
Konferenzbeitrag
Author(s):
Cuili Chen ; Volker Pickert ; Charalampos Tsimenidis ; Xiang Lu ; Maher Al-Greer ; Thillainathan Logenthiran; Chong Ng; Chunjiang Jia
Abstract:
This paper proposes a measurement technique applied to an unbiased multi-chip power module that is able to distinguish between junction temperature variation and bondwire lift-off. Compared with traditional approaches, the proposed technique requires only one test to monitor and discriminate these two conditions. The proposed technique relies upon the injection of high frequency/low power signals into the Gate-Emitter terminals of an IGBT and then analysing the corresponding frequency response o...     »
Book / Congress title:
CIPS 2018; 10th International Conference on Integrated Power Electronics Systems
Date of congress:
20.03.2018 - 22.03.2018
Publisher:
VDE
Date of publication:
05.06.2018
Year:
2018
Year / month:
2018-03
Month:
Mar
Print-ISBN:
978-3-8007-4540-1
Language:
en
WWW:
http://ieeexplore.ieee.org/stamp/stamp.jsp?arnumber=8403167&isnumber=8402818
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