Low-power 3D integrated ferromagnetic computing (invited)

CMOS integrated circuits; coprocessors; logic circuits; nanomagnetics; three-dimensional integrated circuits; 2D planar implementation; BEOL process; CMOS device research; CMOS scaling; atto-joule dissipation; back-end-of-line process; coprocessor architecture; data-throughputs; ferromagnetic domain; high-performance CMOS CPU; highly-dense computing structures; low-power 3D integrated ferromagnetic computing; monolithic 3D integrated systems; nonvolatile ferromagnetic computing states; pNML; perpendicular nanomagnetic logic; Logic gates; Magnetic domain walls; Magnetic domains; Magnetic hysteresis; Perpendicular magnetic anisotropy; Three-dimensional displays     «

CMOS integrated circuits; coprocessors; logic circuits; nanomagnetics; three-dimensional integrated circuits; 2D planar implementation; BEOL process; CMOS device research; CMOS scaling; atto-joule dissipation; back-end-of-line process; coprocessor architecture; data-throughputs; ferromagnetic domain; high-performance CMOS CPU; highly-dense computing structures; low-power 3D integrated ferromagnetic computing; monolithic 3D integrated systems; nonvolatile ferromagnetic computing states; pNML; per...     »