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- Title:
Flip-Chip Bonded Si Schottky Diode Sampling Circuits for High Speed Demultiplexers
- Author(s):
- Choi, Jung Han; Weiske, C.-J.; Olbrich, Gerhard R.; Russer, Peter
- Abstract:
- This paper presents a Si Schottky diode sampling circuit for demultiplexer using flip-chip technology on alumina substrate (Al/sub 2/O/sub 3/). In order to design circuits, very high speed Si Schottky diodes, having cutoff frequency of 750 GHz, were modeled using the Root diode model and flip-chip interconnection was simulated using 3 dimensional electromagnetic simulator, HFSS.
- Keywords:
- 750 GHz, Al/sub 2/O/sub 3/, alumina substrate, demultiplexing equipment, elemental semiconductors, flip-chip bonding, flip-chip devices, HFSS, high-speed demultiplexer, Root diode model, Schottky diodes, Si, Si Schottky diode sampling circuit, signal processing equipment, silicon, three-dimensional electromagnetic simulation
- Book / Congress title:
- IEEE MTT-S International Microwave Symposium
- Volume:
- 3
- Publisher address:
- Philadelphia, PA, USA
- Year:
- 2003
- Month:
- jun
- Pages:
- 1515--1518
- Print-ISBN:
- 0149-645X
- Fulltext / DOI:
- doi:10.1109/MWSYM.2003.1210424
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