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- Titel:
Resilience and Yield of Flip-Flops in Future CMOS Technologies under Process Variations and Aging
- Autor(en):
- Werner, Christoph; Backs, Benedikt; Wirnshofer, Martin; Schmitt-Landsiedel, Doris
- Zeitschriftentitel:
- To appear in: IET Circuits, Devices & Systems
- Jahr:
- 2013
- Volltext / DOI:
- doi:10.1049/iet-cds.2013.0122
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