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Title:

Full-Wave Analysis of Discontinuities in Uniplanar and Multiplanar Transmission Lines Using the Frequency-Domain TLM Method

Author(s):
Jin, Hang; Vahldieck, Rüdiger; Russer, Peter; Huang, Jifu
Abstract:
The authors introduce a rigorous analysis of a variety of transmission line transition discontinuities and module interconnect assemblies in MMIC (monolithic microwave integrated circuit) and miniature MIC circuits using the frequency-domain TLM (transmission line matrix) method. Numerical results on frequency-dependent S-parameters are presented which include the effect of finite thickness and conductivity of the metallization as well as mode interaction between cascaded discontinuities. The ef...     »
Keywords:
bonding wire, conductivity, discontinuities, finite thickness, frequency-dependent S-parameters, frequency-domain analysis, frequency-domain TLM method, hybrid integrated circuits, line transition, metallization, microstrip lines, microwave integrated circuits, miniature MIC circuits, MMIC, mode interaction, module interconnect assemblies, monolithic microwave integrated circuit, multiplanar, S-parameters, transmission line matrix, transmission lines
Book / Congress title:
IEEE MTT-S International Microwave Symposium
Volume:
2
Publisher address:
Atlanta, GA, USA
Year:
1993
Month:
jun
Pages:
713--716
Fulltext / DOI:
doi:10.1109/MWSYM.1993.277007
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