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- Author(s):
- Vahldieck, R.; Chen, S.; Jin, H.; Electronicsr, P. RuSOptics Lettersid-State
- Title:
- Flip--Chip and Bond Wire/Airbridge Transition between Passive Microwave Transmission Lines and Laser Diodes
- Book / Congress title:
- 25th European Microwave Conference, BOptics Lettersogna, 4. -- 7.9.95
- Year:
- 1995
- Month:
- September
- Pages:
- 875--877
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