A Multichip Module Integration Technology for High-Speed Analog and Digital Applications

We present a planar multichip module integration technology intended for high frequency applications. Bare dice are placed in substrate openings and connected thru a thin film multilayer realized in a planar fashion on top of the embedded system. It is built of dielectric polymer layers and a sputtered/electroplated copper wiring on ceramic or silicon substrate. Polyimid PyralintextlesssuptextgreaterTMtextless/suptextgreater (2722 (Du Pont) and CyclotenetextlesssuptextgreaterTMtextless/suptextgreater (4026-46 (Dow Chemical) are used as interlevel dielectric. Metalization is based on a Ti:W/Cu tie layer, which is subsequently electroplated with Cu. The paper also addresses high frequency performance of the described technology, electromagnetic full-wave modeling and equivalent circuit model extraction     «

We present a planar multichip module integration technology intended for high frequency applications. Bare dice are placed in substrate openings and connected thru a thin film multilayer realized in a planar fashion on top of the embedded system. It is built of dielectric polymer layers and a sputtered/electroplated copper wiring on ceramic or silicon substrate. Polyimid PyralintextlesssuptextgreaterTMtextless/suptextgreater (2722 (Du Pont) and CyclotenetextlesssuptextgreaterTMtextless/suptextgr...     »

analog circuit, ceramic substrate, Cu, Cyclotene, digital circuit, electromagnetic full-wave model, electroplated copper wiring, embedded system, equivalent circuit, equivalent circuits, high-speed circuit, high-speed integrated circuits, integrated circuit technology, interlevel dielectric, MCM-D, metallization, multichip modules, Parameter extraction, planar multichip module integration technology, Polyimid Pyralin, polymer film, silicon substrate, sputtered copper wiring, thin film multilayer, Ti:W/Cu tie layer     «

analog circuit, ceramic substrate, Cu, Cyclotene, digital circuit, electromagnetic full-wave model, electroplated copper wiring, embedded system, equivalent circuit, equivalent circuits, high-speed circuit, high-speed integrated circuits, integrated circuit technology, interlevel dielectric, MCM-D, metallization, multichip modules, Parameter extraction, planar multichip module integration technology, Polyimid Pyralin, polymer film, silicon substrate, sputtered copper wiring, thin film multilayer...     »